Acquisition of Wood Flooring and Adhesives

The Department of State has issued solicitation 19JA8026Q0017 for the acquisition of wood flooring and adhesives to be used at the U.S. Embassy Housing Compound in Tokyo, Japan. This requirement falls under NAICS 321999, All Other Miscellaneous Wood Product Manufacturing, and PSC 5510, Lumber and Related Basic Wood Materials. There is no set-aside assigned to this procurement. The government intends to award a firm-fixed-price purchase order to the responsible company that provides the lowest-priced, technically acceptable quotation. While the agency expects to make an award based on initial submissions without discussions, it reserves the right to engage with companies within a competitive range if necessary.

Quotations must be submitted electronically to the primary point of contact by the response deadline of March 27, 2026. All vendors must be registered in the System for Award Management (SAM) database prior to receiving a contract award. Performance will take place in Minato-ku, Japan, and Christopher G. Staff is identified as the contracting point of contact. The solicitation package includes four attachments: the original cover letter and Request for Quotations (RFQ) posted on February 27, 2026, and three subsequent amendments providing quality assurance and administrative approvals, the latest of which was posted on March 25, 2026.